Manufacturing
One-stop service in manufacturing.
Abundant production lines to meet any needs.
Real-time tracking of manufacturing progress.
Professional DFM technical support.
Focus on the production line to cost control.
Fab.
SMT
Design
Comp.
Assembly
√ Single
√ Double
√ Multilayer
√ HDI
√ FPC
√ Aluminum
√ High TG
√ High Freq.
√ Thick
√ Mixed
√ Metal
√ HF
Development to MP, Domestic to foreign, Industrial equipment to consumer electronics, Single panel to HDI,
According to a variety of different needs, we can provide you with the best solutions and the best value service.
| Layer count | 2 to 40L |
Maximum Panel size | 533×610mm 21i×24i |
Minimum Board thickness | 0.60mm 0.024i |
Maximum Board thickness | 2.4mm 0.0945i |
Minimum core thickness (I/L) | 0.75mm 0.003i |
Minimum Cu thickness (Base) | 1/3 oz 12um |
Maximum Cu thickness (Base) | 2.0 oz 70um |
Drilling Hole to hole accuracy | ±0.075mm ±0.003i |
Routing Edge to Edge accuracy | ±0.10mm ±0.004i |
Stamping Edge to Edge accuracy | ±0.076mm ±0.003i |
Vee-cut Edge to Edge accuracy | ±0.127mm ±0.005i |
| PTH Tolerance | ±0.05mm |
| NPTH Tolerance | ±0.076mm/-0mm ±0.003i/-0i |
Min.drill size | 0.2mm 0.0078i |
Aspect Ratio | 6:1 |
Trace width tolerance (≥4mils) | ±20% |
Minimum trace width | 0.076mm 0.003i |
Registration (O/L) | ±0.076mm ±0.003i |
Rich available resources to adapt different requirements, including diverse variety, medium and small batch, quick response.
Officially authorized purchasing channels to ensure original services.
Consolidated orders and concentrated purchase to lower the price of human-power and logistics.
Support from professional technical team to provide one-stop services, including stocking, purchasing, consulting and etc.
SCM
Memory
LogicIC
Diode
Diode
Transistor
Capacitor
Resistance
AnaiogIC
Sensor
Connector
Switch
Battery
Crystal
Fuse
Wireless
